Press mounting of drive plate for IBGT
In the electronics manufacturing industry, the IGBT (Insulated Gate Bipolar Transistor) is an indispensable component.IGBTs play a crucial role in high-power electronic devices such as electric vehicles, solar power systems, and industrial equipment. Therefore, quality and precision in the manufacturing process of IGBT circuit boards are vital to ensure reliability and performance.
1. Technical Specifications:
Voltage: 3P-380V, 50Hz
Air Pressure: 0.4–0.6 Mpa
Maximum Pressing Force: 5 kN
Set Pressing Force: 2.88 kN
Stroke: 200 mm
Post-pressing Position Tolerance: ±0.1 mm
Cycle Time: 81 seconds/product
Pressing Device: Kistler
Dimensions (L×W×H): 2350 × 2165 × 2100 mm
2. Applied Technologies:
5kN Kistler Servo Press: Precisely controls pressing force up to 5kN; flexible stroke and speed for secure assembly without deformation; integrated force and position sensors allow real-time monitoring and adjustments.
±0.1 mm Tolerance Control: Ensures accurate placement of circuit legs, preventing connection errors and improving stability and lifespan of IGBT.
Cognex Camera for Height Inspection: Monitors leg height before and after pressing; quickly detects deviations, reduces errors, and enhances product quality.
MES (Manufacturing Execution System): Collects and analyzes real-time data from the entire production process; supports monitoring, traceability, and process optimization.
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