Glass and silicon, though possessing different properties, are important materials in the field of precision processing. Glass is an amorphous, hard material with excellent transparency, heat resistance, and chemical stability, used in optical lenses, display substrates, medical containers, and more. Due to its brittleness, processing involves mechanical methods such as cutting, grinding, and polishing, in addition to laser processing and chemical etching. On the other hand, silicon is indispensable as a semiconductor material, with high-purity single crystals serving as substrates for IC chips, solar cells, and MEMS devices. Its processing requires fine and high-precision techniques such as photolithography, etching (dry/wet), thin-film deposition, dicing, and CMP (Chemical Mechanical Polishing). Both materials are foundational technologies supporting modern industries, which are increasingly characterized by higher functionality and miniaturization.