Transfer molds are primarily used for molding thermosetting resins. Preformed material is placed into a heated pot and pressurized by a plunger, causing it to flow through a sprue, runner, and gate to fill and cure in the cavity. This molding method possesses characteristics intermediate between injection molding and compression molding, and is particularly suitable for molding complex shapes and for encapsulating insert components (such as metal terminals). It is widely used in the encapsulation of electronic components (such as ICs, transistors, and capacitors), and in the manufacturing of connectors, switch components, and automotive electrical components. Because the shear stress on the material is relatively low, it is also advantageous for maintaining the properties of fiber-reinforced resins.